Patent Assignment
Reel/Frame 055911/0859
Assignment of Assignor's Interest
Recorded: 2021-04-14
Pages: 4
Assignor
KIM, GEUN WOO
Executed: 2021-03-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Laser Bonding System and Laser Bonding Apparatus