Patent Assignment
Reel/Frame 055923/0481
Assignment of Assignor's Interest
Recorded: 2021-04-14
Pages: 4
Assignors
CHANG, CHIH-YUAN
Executed: 2021-03-30
WU, JIUN-YI
Executed: 2021-03-30
LEE, CHIEN-HSUN
Executed: 2021-03-31
LIU, CHUNG-SHI
Executed: 2021-03-30
YU, CHEN-HUA
Executed: 2021-04-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Inductor Structure, Semiconductor Package and Fabrication Method Thereof