IP Library › Assignment 055926/0242
Patent Assignment
Reel/Frame 055926/0242

Assignment of Assignor's Interest

Recorded: 2021-04-15 Pages: 3
Assignors
JEONG, JIN WON
Executed: 2021-03-30
CHOI, JAE SIK
Executed: 2021-03-30
SONG, BYEUNG SOO
Executed: 2021-03-30
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
15F, 76 JIKJI-DAERO 436BEON-GIL (JIKJI SMART TOWER), HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, 28581, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Die Forming and Packaging Method Using Ultrashort Pulse Laser Micromachining
Application: 17/231,074 →
Publication: US 2021/0407854
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Mar 14, 2024
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: MAGNACHIP MIXED-SIGNAL, LTD.
Reel/Frame 066878/0875 →
Assignment of Assignor's Interest Jul 7, 2025
From: MAGNACHIP MIXED-SIGNAL, LTD.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 071813/0800 →