IP Library › Assignment 055931/0224
Patent Assignment
Reel/Frame 055931/0224

Assignment of Assignor's Interest

Recorded: 2021-04-15 Pages: 5
Assignors
PAK, JUN SO
Executed: 2021-03-09
KIM, JUNGHWA
Executed: 2021-03-09
LEE, HEESEOK
Executed: 2021-03-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package and Semiconductor Device Including the Same
Application: 17/230,192 →
Publication: US 2022/0068870
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Fourth Inventor Was Missing from the Originally Recorded Assignment Previously Recorded on Reel 055931 Frame 0224. Assignor(S) Hereby Confirms the Assignment. Jun 1, 2023
From: PAK, JUN SO; KIM, JUNGHWA; LEE, HEESEOK; JEONG, MOONSEOB
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 063829/0043 →