Patent Assignment
Reel/Frame 055942/0758
Assignment of Assignor's Interest
Recorded: 2021-04-16
Pages: 4
Assignors
WANG, PO-CHUAN
Executed: 2021-04-06
CHEN, GUAN-XUAN
Executed: 2021-04-16
HUNG, CHIA-YANG
Executed: 2021-04-06
PAN, SHENG-LIANG
Executed: 2021-04-08
LIN, HUAN-JUST
Executed: 2021-04-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure for Semiconductor Devices