Patent Assignment
Reel/Frame 055951/0001
Assignment of Assignor's Interest
Recorded: 2021-04-17
Pages: 4
Assignor
KWON, YONGHWAN
Executed: 2021-03-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package Including Under-Bump Metallurgy