Patent Assignment
Reel/Frame 055955/0054
Assignment of Assignor's Interest
Recorded: 2021-04-19
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure and Method for Forming the Same