Patent Assignment
Reel/Frame 055955/0273
Assignment of Assignor's Interest
Recorded: 2021-04-19
Pages: 4
Assignors
PARK, SUNGCHUL
Executed: 2021-03-08
HA, SANGWON
Executed: 2021-03-05
PARK, CHULWOO
Executed: 2021-03-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI,, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Connection Member Comprising Substrate Having Opening Part, Which Encompasses Region in Which Through Wire Is Formed, and Conductive Member Formed on Side Surface of Opening Part, and Electronic Device Comprising Same