Patent Assignment
Reel/Frame 055956/0696
Assignment of Assignor's Interest
Recorded: 2021-04-19
Pages: 10
Assignors
CHEN, CHAO-YANG
Executed: 2019-03-29
TSAI, CHUN-YANG
Executed: 2019-03-29
HUANG, KUO-CHING
Executed: 2019-04-02
CHU, WEN-TING
Executed: 2019-04-03
HUANG, PILI
Executed: 2019-03-29
WU, CHENG-JUN
Executed: 2019-03-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bottom Electrode Structure in Memory Device