Patent Assignment
Reel/Frame 055960/0825
Assignment of Assignor's Interest
Recorded: 2021-04-19
Pages: 3
Assignors
TSAI, CHEN-HSUAN
Executed: 2019-04-02
TSAI, TSUNG-FU
Executed: 2019-04-02
LIN, SHIH-TING
Executed: 2019-04-02
LU, SZU-WEI
Executed: 2019-04-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with Underfill