Package structure with underfill
A package structure is provided. The package structure includes a substrate and a stack of semiconductor dies over the substrate. The package structure also includes an underfill element covering sidewalls of the semiconductor dies. The package structure further includes a protective film attached to the substrate and laterally surrounding the underfill element and the semiconductor dies. The underfill element separates the protective film from the semiconductor dies.
1. A package structure, comprising:
a substrate;
a stack of semiconductor dies over the substrate;
an underfill element covering sidewalls of the semiconductor dies; and
a protective film over the substrate and laterally surrounding the underfill element and the semiconductor dies, wherein the underfill element separates the protective film from the semiconductor dies, the protective film comprises first fillers, the underfill element comprises second fillers, and the first fillers have a greater average size than that of the second fillers.
2. The package structure as claimed in claim 1 , wherein the protective film has a first weight percentage of fillers, the underfill element has a second weight percentage of fillers, and the first weight percentage of fillers is greater than the second weight percentage of fillers.
3. The package structure as claimed in claim 1 , wherein the underfill element is in direct contact with the protective film.
4. The package structure as claimed in claim 1 , wherein a top of the stack of the semiconductor dies is substantially as high as a top of the underfill element.
5. The package structure as claimed in claim 1 , wherein the protective film has a first interior sidewall and a second interior sidewall, and the first interior sidewall and the second interior sidewall are in direct contact with the underfill element.
6. The package structure as claimed in claim 5 , wherein the stack of the semiconductor dies is closer to the second interior sidewall than the first interior sidewall.
7. The package structure as claimed in claim 1 , further comprising a through substrate via in the stack of the semiconductor dies, wherein the through substrate via forms electrical connection between at least two of the semiconductor dies.
8. The package structure as claimed in claim 1 , wherein portions of the underfill element extend into spaces between the semiconductor dies to laterally surround bonding structures between the semiconductor dies.
9. The package structure as claimed in claim 1 , wherein a top of the protective film is separated from the stack of the semiconductor dies by a first distance, a bottom of the protective film is separated from the stack of the semiconductor dies by a second distance, and the first distance and the second distance are different from each other.
10. The package structure as claimed in claim 1 , wherein the protective film has an interior sidewall, a lower portion of the interior sidewall is in direct contact with the underfill element, and an upper portion of the interior sidewall is separated from the underfill element.
11. A package structure, comprising:
a substrate;
a semiconductor die over the substrate;
an underfill element laterally surrounding the semiconductor die; and
a protective film laterally surrounding the underfill element and the semiconductor die, wherein tops of the underfill element and the protective film are substantially as high as each other, the protective film has a first weight percentage of fillers, the underfill element has a second weight percentage of fillers, and the first weight percentage of fillers is greater than the second weight percentage of fillers.
12. The package structure as claimed in claim 11 , wherein a top of the protective film is separated from the semiconductor die by a first distance, a bottom of the protective film is separated from the semiconductor die by a second distance, and the first distance and the second distance are different from each other.
13. The package structure as claimed in claim 11 , wherein the protective film has a first interior sidewall and a second interior sidewall, and the second interior sidewall is closer to the semiconductor die than the first interior sidewall.
14. The package structure as claimed in claim 11 , wherein the protective film comprises first fillers, the underfill element comprises second fillers, and the first fillers have a greater average size than that of the second fillers.
15. The package structure as claimed in claim 12 , wherein the first distance is greater than the second distance.
16. A package structure, comprising:
a substrate;
a semiconductor die over the substrate;
an underfill element covering sidewalls of the semiconductor die, wherein edges of the underfill element form a quadrilateral, in a top view; and
a protective film laterally surrounding the semiconductor die and the underfill element, wherein the protective film has a first interior sidewall and a second interior sidewall, and the semiconductor die is closer to the second interior sidewall than the first interior sidewall.
17. The package structure as claimed in claim 16 , wherein an entirety of the sidewalls of the semiconductor die is covered by the underfill element.
18. The package structure as claimed in claim 16 , wherein a top of the protective film is separated from the semiconductor die by a first distance, a bottom of the protective film is separated from the semiconductor die by a second distance, and the first distance and the second distance are different from each other.
19. The package structure as claimed in claim 16 , wherein tops of the protective film and the underfill element are substantially as high as each other.
20. The package structure as claimed in claim 16 , wherein the protective film comprises first fillers, the underfill element comprises second fillers, and the first fillers have a greater average size than that of the second fillers.