Patent Assignment
Reel/Frame 055994/0321
Assignment of Assignor's Interest
Recorded: 2021-04-21
Pages: 3
Assignor
IP, NATHAN
Executed: 2021-04-16
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Wafer Bonding Apparatus and Methods to Reduce Post-Bond Wafer Distortion