Patent Assignment
Reel/Frame 055996/0281
Assignment of Assignor's Interest
Recorded: 2021-04-22
Pages: 5
Assignors
YU, TSUNG-YUAN
Executed: 2021-03-21
KUO, HUNG-YI
Executed: 2021-03-18
HSIEH, CHENG-CHIEH
Executed: 2021-03-18
TSAI, HAO-YI
Executed: 2021-03-18
WENG, CHUNG-MING
Executed: 2021-03-18
LIN, HUA-KUEI
Executed: 2021-03-19
HSU, CHE-HSIANG
Executed: 2021-04-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Photonic Integrated Circuit and Package Structure