Patent Assignment
Reel/Frame 055997/0619
Assignment of Assignor's Interest
Recorded: 2021-04-21
Pages: 4
Assignors
EID, FERAS
Executed: 2016-12-07
OSTER, SASHA N.
Executed: 2016-12-07
KAMGAING, TELESPHOR
Executed: 2016-12-07
DOGIAMIS, GEORGIOS C.
Executed: 2016-12-07
ALEKSOV, ALEKSANDAR
Executed: 2016-12-07
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Microelectronic Devices Designed with Mold Patterning to Create Package-Level Components for High Frequency Communication Systems