Patent Assignment
Reel/Frame 056007/0205
Assignment of Assignor's Interest
Recorded: 2021-04-22
Pages: 3
Assignors
SHENG, RUEI YING
Executed: 2021-04-22
BAYLESS, ANDREW M.
Executed: 2021-04-15
WIRZ, BRANDON P.
Executed: 2021-04-14
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Semiconductor Devices with Recessed Pads for Die Stack Interconnections