Patent Assignment
Reel/Frame 056009/0164
Assignment of Assignor's Interest
Recorded: 2021-04-22
Pages: 4
Assignors
TSAI, YA-YI
Executed: 2020-10-19
CHANG, CHI-HSIANG
Executed: 2020-10-19
LIN, SHIH-YAO
Executed: 2020-10-19
WANG, TZU-CHUNG
Executed: 2020-10-19
KU, SHU-YUAN
Executed: 2020-10-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-Layer Dielectric Refill for Profile Control in Semiconductor Devices