Patent Assignment
Reel/Frame 056041/0067
Assignment of Assignor's Interest
Recorded: 2021-04-26
Pages: 3
Assignors
FATIN FARHANAH, BINTI HARIDAN
Executed: 2021-04-05
YOGO, TAKAYUKI
Executed: 2021-03-16
ABE, HIROYUKI
Executed: 2021-03-16
Assignee
HITACHI ASTEMO, LTD.
2520, TAKABA, HITACHINAKA-SHI, IBARAKI, JAPAN
Covered Property
(1)
Chip Package Positioning and Fixing Structure