Patent Assignment
Reel/Frame 056044/0054
Assignment of Assignor's Interest
Recorded: 2021-04-26
Pages: 12
Assignors
PIETAMBARAM, SRINIVAS V.
Executed: 2021-02-21
MALLIK, DEBENDRA
Executed: 2021-02-19
DARMAWIKARTA, KRISTOF
Executed: 2021-02-25
MAHAJAN, RAVINDRANATH V.
Executed: 2021-02-24
MANEPALLI, RAHUL N.
Executed: 2021-02-18
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Nested Interposer with Through-Silicon via Bridge Die