Patent Assignment
Reel/Frame 056048/0472
Assignment of Assignor's Interest
Recorded: 2021-04-27
Pages: 13
Assignors
HAYES, SCOTT M.
Executed: 2021-04-26
VINCENT, MICHAEL B.
Executed: 2021-04-26
GONG, ZHIWEI
Executed: 2021-04-26
TANK, RUSHIK P.
Executed: 2021-04-26
MIRPURI, KABIR
Executed: 2021-04-26
YEUNG, BETTY HILL-SHAN
Executed: 2021-04-26
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property
(1)
Semiconductor Device Package Having Thermal Dissipation Feature and Method Therefor