Patent Assignment
Reel/Frame 056050/0566
Assignment of Assignor's Interest
Recorded: 2021-04-27
Pages: 3
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board and Method for Manufacturing the Same