IP Library › Assignment 056052/0200
Patent Assignment
Reel/Frame 056052/0200

Assignment of Assignor's Interest

Recorded: 2021-04-27 Pages: 3
Assignor
OP DE BEECK, MARIA
Executed: 2021-02-02
Assignee
IMEC VZW
KAPELDREEF 75, LEUVEN, B-3001, BELGIUM
Covered Property (1)
Implantable Sensor Electronics Packaging
Application: 17/123,101 →
Publication: US 2022/0183558
Related Assignments (7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 27, 2021
From: MIKHAIL, GEORGE; VU, BINH
To: SYNTHES USA PRODUCTS, LLC
Reel/Frame 056051/0577 →
Assignment of Assignor's Interest Apr 27, 2021
From: WALSER, JOCHEN
To: SYNTHES GMBH
Reel/Frame 056051/0733 →
Assignment of Assignor's Interest Apr 27, 2021
From: DLUGOS, DANIEL
To: ETHICON ENDO-SURGERY, INC.
Reel/Frame 056051/0877 →
Assignment of Assignor's Interest Apr 27, 2021
From: FICHMAN, MARK; LEE, SEULKI; SHAHRIARI, NAVID; SHEIKHI, ERFAN
To: STICHTING IMEC NEDERLAND
Reel/Frame 056052/0083 →
Assignment of Assignor's Interest Apr 27, 2021
From: SYNTHES USA PRODUCTS, LLC
To: DEPUY SYNTHES PRODUCTS, INC.
Reel/Frame 056052/0401 →
Assignment of Assignor's Interest Apr 27, 2021
From: SYNTHES GMBH
To: DEPUY SYNTHES PRODUCTS, INC.
Reel/Frame 056052/0498 →
Assignment of Assignor's Interest Apr 27, 2021
From: ETHICON ENDO-SURGERY, INC.
To: DEPUY SYNTHES PRODUCTS, INC.
Reel/Frame 056052/0600 →