IP Library Assignment 056055/0131
Patent Assignment
Reel/Frame 056055/0131

Change of Name

Recorded: 2021-02-26 Pages: 53
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Lead-Free Glass Composition, and Glass Composite Material, Glass Paste, and Sealing Structure Body Containing the Same
Application: 16/424,854 →
Publication: US 2019/0367405
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 16, 2020
From: NAITO, TAKASHI; ONODERA, TAIGO; MIYAKE, TATSUYA; KONNO, AKITOYO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052120/0411 →
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →