Patent Assignment
Reel/Frame 056055/0305
Assignment of Assignor's Interest
Recorded: 2021-04-27
Pages: 4
Assignors
CHEN, TING-JUNG
Executed: 2021-04-21
LIN, SHIH-WEI
Executed: 2021-04-21
TSENG, LEE-CHUAN
Executed: 2021-04-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Wafer Chuck Structure with Holes in Upper Surface to Improve Temperature Uniformity