IP Library Assignment 056064/0868
Patent Assignment
Reel/Frame 056064/0868

Assignment of Assignor's Interest

Recorded: 2021-04-28 Pages: 8
Assignors
OKUNO, KATSUKI
Executed: 2021-04-10
MINAMI, TAKUYA
Executed: 2021-04-15
TAKEMOTO, SHIMPEI
Executed: 2021-04-15
TAKEDA, ERIKO
Executed: 2021-04-15
OKUNO, YOSHISHIGE
Executed: 2021-04-15
KITANO, MASAMICHI
Executed: 2021-04-15
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Material Design Device, Material Design Method, and Material Design Program
Application: 17/289,277 →
Publication: US 2021/0397769
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 18, 2023
From: SHOWA DENKO K.K.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064535/0265 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →