IP Library Assignment 056066/0414
Patent Assignment
Reel/Frame 056066/0414

Assignment of Assignor's Interest

Recorded: 2021-04-28 Pages: 3
Assignor
HONG, EUNSEOK
Executed: 2021-03-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Wiring Member Having Bending Property and Electronic Device Comprising Same
Application: 17/287,334 →
Publication: US 2021/0360814