Patent Assignment
Reel/Frame 056069/0276
Assignment of Assignor's Interest
Recorded: 2021-04-28
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2020-08-24
HSIEH, JENG-SHIEN
Executed: 2020-08-24
WANG, CHUEI-TANG
Executed: 2020-08-24
CHEN, CHIEH-YEN
Executed: 2020-08-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method