Patent Assignment
Reel/Frame 056074/0880
Assignment of Assignor's Interest
Recorded: 2021-04-28
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD.6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Structure and Fabrication Thereof
Patent:
11,456,182 →
Application:
17/237,694 →