IP Library › Assignment 056088/0953
Patent Assignment
Reel/Frame 056088/0953

Assignment of Assignor's Interest

Recorded: 2021-04-29 Pages: 4
Assignors
HSU, CHUNG-WEI
Executed: 2021-01-27
CHIANG, KUO-CHENG
Executed: 2021-01-27
HUANG, MAO-LIN
Executed: 2021-01-27
CHU, LUNG-KUN
Executed: 2021-01-27
YU, JIA-NI
Executed: 2021-01-27
CHENG, KUAN-LUN
Executed: 2021-01-27
WANG, CHIH-HAO
Executed: 2021-01-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Structures and Methods Thereof
Application: 17/228,922 →
Publication: US 2022/0140097
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 25, 2023
From: HSU, CHUNG-WEI; CHIANG, KUO-CHENG; HUANG, MAO-LIN; CHU, LUNG-KUN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 064705/0349 →