Patent Assignment
Reel/Frame 056095/0947
Assignment of Assignor's Interest
Recorded: 2021-04-30
Pages: 3
Assignors
LIN, WEN-YI
Executed: 2021-04-27
LEE, KUANG-CHUN
Executed: 2021-04-27
LI, CHIEN-CHEN
Executed: 2021-04-23
CHEN, CHEN-SHIEN
Executed: 2021-04-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Chip Package with Protective Lid