IP Library › Assignment 056118/0470
Patent Assignment
Reel/Frame 056118/0470

Assignment of Assignor's Interest

Recorded: 2021-05-03 Pages: 5
Assignors
LEE, JEONGHO
Executed: 2020-12-21
LEE, DOOHWAN
Executed: 2020-12-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package
Application: 17/306,555 →
Publication: US 2021/0407924