Patent Assignment
Reel/Frame 056124/0039
Assignment of Assignor's Interest
Recorded: 2021-05-04
Pages: 5
Assignors
DING, JIAPEI
Executed: 2021-05-03
CAMBA, ROLAN OCUAMAN
Executed: 2021-05-03
KUAH, TENG HOCK
Executed: 2021-05-03
LIAO, JIAN
Executed: 2021-05-03
YAN, KAR WENG
Executed: 2021-05-03
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Flexible Sinter Tool for Bonding Semiconductor Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.