Patent Assignment
Reel/Frame 056124/0110
Assignment of Assignor's Interest
Recorded: 2021-05-04
Pages: 6
Assignors
CHOI, HEEJUNG
Executed: 2021-04-19
LEE, HEESEOK
Executed: 2021-04-19
KIM, JUNGHWA
Executed: 2021-04-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same