Patent Assignment
Reel/Frame 056126/0761
Assignment of Assignor's Interest
Recorded: 2021-05-04
Pages: 5
Assignors
WU, PEI-HSUN
Executed: 2020-01-31
HAN, MING-HUNG
Executed: 2020-01-31
CHEN, PO-NIEN
Executed: 2020-01-31
LIN, CHIH-YUNG
Executed: 2020-02-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Gate-All-Around Devices Having Gate Dielectric Layers of Varying Thicknesses and Method of Forming the Same