Patent Assignment
Reel/Frame 056127/0259
Assignment of Assignor's Interest
Recorded: 2021-05-04
Pages: 6
Assignors
RYU, HYO-CHANG
Executed: 2021-03-08
KIM, CHULWOO
Executed: 2021-03-10
LYU, JUHYUN
Executed: 2021-03-08
LEE, SANGHYUN
Executed: 2021-03-10
CHOI, YUN SEOK
Executed: 2021-03-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Heat Dissipation Member