Patent Assignment
Reel/Frame 056128/0339
Assignment of Assignor's Interest
Recorded: 2021-05-04
Pages: 4
Assignor
PARK, JIWOO
Executed: 2021-02-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Packaged Semiconductor Devices Having Spacer Chips with Protective Groove Patterns Therein