Patent Assignment
Reel/Frame 056130/0865
Security Interest
Recorded: 2021-05-04
Pages: 7
Assignor
ADHEZION, LLC
Executed: 2021-05-03
Assignee
MADISON CAPITAL FUNDING LLC, AS ADMINISTRATIVE AGENT
227 W. MONROE STREET, SUITE 5400, CHICAGO, ILLINOIS, 60606
Covered Property
(1)
System, Method, and Apparatus for Hot Melt Adhesive Application
Patent:
11,065,640 →
Application:
16/162,989 →
Publication:
US 2020/0122189
PCT:
PCT/US2019/055806 ↗
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 17, 2018
From: ANTONIE, MIKE
To: ADHEZION, INC.
Reel/Frame 047199/0670 →
Change of Name
May 3, 2021
From: ADHEZION, INC.
To: ADHEZION, LLC
Reel/Frame 056123/0084 →
Assignment of Intellectual Property Security Agreement
Apr 13, 2022
From: MADISON CAPITAL FUNDING LLC, AS RETIRING AGENT
To: APOGEM CAPITAL LLC, AS SUCCESSOR AGENT
Reel/Frame 059691/0771 →
Patent Security Agreement
Apr 11, 2025
From: ADHEZION, LLC
To: ARES CAPITAL CORPORATION, AS COLLATERAL AGENT
Reel/Frame 070822/0747 →
Release of Security Interests in Patents
Apr 11, 2025
From: APOGEM CAPITAL LLC (SUCCESSOR TO MADISON CAPITAL FUNDING LLC), AS AGENT
To: ADHEZION, LLC
Reel/Frame 070863/0543 →