Patent Assignment
Reel/Frame 056147/0256
Assignment of Assignor's Interest
Recorded: 2021-05-05
Pages: 2
Assignor
CHOI, BOK KYU
Executed: 2021-04-23
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Stacked Semiconductor Chips