Patent Assignment
Reel/Frame 056160/0470
Assignment of Assignor's Interest
Recorded: 2021-05-06
Pages: 3
Assignors
PENG, SHIH-WEI
Executed: 2021-05-03
HSIAO, CHIH-MIN
Executed: 2021-05-03
TZENG, JIANN-TYNG
Executed: 2021-05-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit, System and Method of Forming Same