Patent Assignment
Reel/Frame 056164/0165
Assignment of Assignor's Interest
Recorded: 2021-05-06
Pages: 4
Assignors
SUN, HUNG-CHANG
Executed: 2021-04-19
LAI, SHENG-CHIH
Executed: 2021-04-12
YANG, TSUCHING
Executed: 2021-04-22
JIANG, YU-WEI
Executed: 2021-04-13
CHIANG, KUO-CHANG
Executed: 2021-04-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Memory Device and Method of Forming the Same