IP Library › Assignment 056164/0910
Patent Assignment
Reel/Frame 056164/0910

Assignment of Assignor's Interest

Recorded: 2021-05-07 Pages: 4
Assignors
LEE, JI HWA
Executed: 2021-04-01
LEE, KYUNG DUK
Executed: 2021-04-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package and Electronic Device Including Same
Application: 17/238,734 →
Publication: US 2021/0351103