Patent Assignment
Reel/Frame 056166/0489
Assignment of Assignor's Interest
Recorded: 2021-05-07
Pages: 6
Assignors
LEE, MYUNG HUN
Executed: 2021-04-30
SHIN, DONG HA
Executed: 2021-04-30
KWAK, PAN SUK
Executed: 2021-04-30
BYEON, DAE SEOK
Executed: 2021-04-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device with Mold Structure