Patent Assignment
Reel/Frame 056170/0954
Assignment of Assignor's Interest
Recorded: 2021-05-07
Pages: 5
Assignors
HUANG, JIAN-ZHI
Executed: 2021-04-27
HSU, YUN-HSUAN
Executed: 2021-04-26
NI, I-CHIH
Executed: 2021-04-26
WU, CHIH-I
Executed: 2021-04-27
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
NATIONAL TAIWAN UNIVERSITY
NO.1, SEC. 4, ROOSEVELT ROAD, TAIPEI, 10617, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Forming the Same