Patent Assignment
Reel/Frame 056171/0806
Assignment of Assignor's Interest
Recorded: 2021-05-06
Pages: 3
Assignors
JANG, YONG SOON
Executed: 2021-04-22
LEE, HYUNG KI
Executed: 2021-04-22
KIM, KI SUK
Executed: 2021-04-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Connection Structure Embedded Substrate