Patent Assignment
Reel/Frame 056186/0325
Assignment of Assignor's Interest
Recorded: 2021-05-10
Pages: 2
Assignors
SAKAMOTO, TAKESHI
Executed: 2021-04-09
SUZUKI, YASUTAKA
Executed: 2021-04-16
SANO, IKU
Executed: 2021-04-20
Assignee
HAMAMATSU PHOTONICS K.K.
1126-1, ICHINO-CHO, HIGASHI-KU, HAMAMATSU-SHI, SHIZUOKA, 435-8558, JAPAN
Covered Property
(1)
Laser Processing Method, Semiconductor Device Manufacturing Method, and Examination Device