Patent Assignment
Reel/Frame 056200/0149
Assignment of Assignor's Interest
Recorded: 2021-05-11
Pages: 3
Assignor
YU, GUOQING
Executed: 2021-04-21
Assignee
TONGFU MICROELECTRONICS CO., LTD.
NO. 288, CHONGCHUAN ROAD, NANTONG, 226006, CHINA
Covered Property
(1)
Semiconductor Package Device Having Chip Substrate with Pads Around Photosensitive Region