Patent Assignment
Reel/Frame 056200/0709
Assignment of Assignor's Interest
Recorded: 2021-05-11
Pages: 6
Assignors
KIM, CHANGOH
Executed: 2021-05-11
JUNG, JINHEE
Executed: 2021-05-11
LEE, JIWON
Executed: 2021-05-11
JANG, YUJEONG
Executed: 2021-05-11
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Multi-Layer Shielding Structure With Layers of Ferromagnetic Material, Protective Material, Laminate Material or Conductive Material Over the Semiconductor Device