Patent Assignment
Reel/Frame 056205/0344
Assignment of Assignor's Interest
Recorded: 2021-05-11
Pages: 2
Assignor
SON, HO YOUNG
Executed: 2021-04-29
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Including Through Electrodes, and Semiconductor Package Including the Same