Patent Assignment
Reel/Frame 056207/0133
Assignment of Assignor's Interest
Recorded: 2021-05-11
Pages: 6
Assignors
LAU, JOHN HON-SHING
Executed: 2021-03-26
KO, CHENG-TA
Executed: 2021-03-17
LIN, PU-JU
Executed: 2021-03-17
TSENG, TZYY-JANG
Executed: 2021-03-29
TAIN, RA-MIN
Executed: 2021-03-29
YANG, KAI-MING
Executed: 2021-03-16
Assignee
UNIMICRON TECHNOLOGY CORP.
NO. 179, SHANYING RD., GUISHAN DIST.,, TAOYUAN CITY, 333, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof