IP Library Assignment 056215/0759
Patent Assignment
Reel/Frame 056215/0759

Assignment of Assignor's Interest

Recorded: 2021-05-12 Pages: 3
Assignor
OKUYAMA, ATSUSHI
Executed: 2013-02-12
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Properties (5)
Semiconductor Device and Method for Production of Semiconductor Device
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Semiconductor Device and Method for Production of Semiconductor Device
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Semiconductor Device with a Connection Pad in a Substrate and Method for Production Thereof
Patent: 9,269,680 →
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Semiconductor Device and Method for Production of Semiconductor Device
Patent: 9,679,937 →
Application: 14/992,865 →
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Semiconductor Device and Method for Production of Semiconductor Device
Patent: 9,941,323 →
Application: 15/619,156 →
Publication: US 2017/0278891