Patent Assignment
Reel/Frame 056215/0759
Assignment of Assignor's Interest
Recorded: 2021-05-12
Pages: 3
Assignor
OKUYAMA, ATSUSHI
Executed: 2013-02-12
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Properties
(5)
Semiconductor Device and Method for Production of Semiconductor Device
Semiconductor Device and Method for Production of Semiconductor Device
Semiconductor Device with a Connection Pad in a Substrate and Method for Production Thereof
Semiconductor Device and Method for Production of Semiconductor Device
Semiconductor Device and Method for Production of Semiconductor Device