Patent Assignment
Reel/Frame 056217/0893
Assignment of Assignor's Interest
Recorded: 2021-05-12
Pages: 4
Assignors
HSU, CHE-MING
Executed: 2021-05-06
LIN, SUNG-YUAN
Executed: 2021-05-06
HSUAN, NAI-JEN
Executed: 2021-05-06
WANG, YU-HSIN
Executed: 2021-05-06
Assignee
REALTEK SEMICONDUCTOR CORP.
NO.2, INNOVATION RD. II, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Ball Grid Array Package and Package Substrate Thereof